Y. Jiao, J.J.G.M. van der Tol, L. Shen, A. Millan Mejia, H.P.M.M. Ambrosius, M.K. Smit and K.A. Williams
the 38th Progress In Electromagnetics Research Symposium (PIERS), 22-25 May, 2017, St. Petersburg, Russia
Publication year: 2017


The indium phosphide (InP) photonic integrated circuit (PIC) industry has been offering sensing solutions on a chip, with high precision and low cost. The major application is sensor signal read-out. Its next generation, where the InP PICs are much smaller and faster, enables new sensing opportunities. We review our recent developments in the next-generation InP PIC, and discuss their potential in optical sensing.

Leave a Reply

Your email address will not be published. Required fields are marked *