Y. Jiao, L. Shen, Z. Cao, S. Latkowski, E. Bente, J. van der Tol, H. Ambrosius, M. Smit and K. Williams
25th Wireless and Optical Communication Conference (WOCC2016), 21 – 23 May 2016, Chengdu, China.
Publication year: 2016

Abstract:

In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in the InP generic and InP membrane platforms for wireless and sensing applications are reviewed. The realized chips show the great potential of the InP-based photonic integration due to its full functionality, high flexibility and high performance.

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