W. Yao, Y. Jiao and K.A. Williams
Featured Article in PIC Magazine, Issue 11 - October 2018.
Publication year: 2018

Generic multi-project wafer (MPW) runs have enabled new photonic integrated circuits (PICs) by lowering costs and providing proof of concept. But for PICs to achieve future performance targets, researchers envision utilizing new nanophotonic scaling concepts. By: Weiming Yao, Y. Jiao, K. A. Williams, Eindhoven University of Technology

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