Y. Jiao
at the SPIE/COS Photonics Asia, 11-13 October 2018, Beijing, China.
Publication year: 2018


In this work we present an integrated platform based on an InP membrane adhesively bonded to a silicon wafer. The platform allows for flexible design of wafer scale active and passive nanophotonic circuits. Advantages of this platform are the flexible fabrication process, large variety of integrated active and passive devices in one photonic layer, high index contrast of devices and therefore small footprint of complex circuits. We demonstrated several building blocks and devices, fabricated in the platform: semiconductor optical amplifiers, lasers and several passive devices, exploiting the high index contrast. Potential of the platform offers the integration of novel high speed devices using regrowth approach.

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